The STF1200 Series Furnace is a highly versatile tool designed for Chemical Vapor Deposition (CVD) and Plasma-Enhanced Chemical Vapor Deposition (PECVD) applications. It combines precise temperature control, robust design, and advanced RF generator capabilities, making it ideal for research and industrial thin-film processing.

Key Features

Furnace

1. Efficient Heating System

   • Kanthal A1 (Sweden) wire heating elements ensure reliable and uniform heating.
   • Mitsubishi (Japan) 1500-grade alumina fiber insulation minimizes heat loss.

2. User-Friendly Operation

   • Split-tube, top-open design provides easy access to the tube for faster loading/unloading.
   • Ultra-fast cooling rates with optional furnace rail system.
   • Built-in computer interface for real-time monitoring and control via PC.

3. Precise Temperature Control

   • Eurotherm (UK) digital controller:
     • 3204 Model: Supports up to 8 programming segments.
     • 3504 Model: Supports up to 50 programming segments for complex temperature profiles.
   • Self-tuning PID control for precise thermal management with minimal overshoot.
   • Long-life type K thermocouple for dependable temperature measurement.

4. Multiple Atmosphere Capability

   • Handles vacuum, inert, and air environments within the same cycle.

5. Safety and Durability

   • Overheat protection: Automatic shutdown during temperature deviations or thermocouple failures.
   • Power failure protection: Automatically resumes operation from failure point.
   • Stainless steel vacuum flanges and durable dual-layer steel housing.

RF Generator

• Output Power: Adjustable from 5 to 500 watts in ±1% increments.
• Frequency: 13 MHz with ±0.005% stability for consistent plasma generation.
• Reflection Power: Maximum of 200 watts.
• Automatic Matching for optimal plasma conditions.
• Output Port: 50 Ω, N-type (female) connection.
• Air-cooled for reliable operation.

Specifications

Furnace

• Tube Material: Quartz
• Max/Constant Working Temperatures: 1200°C max, 1100°C constant
• Heating Rate: Up to 30°C/min
• Temperature Precision: ±1°C (±1.8°F)
• Refractory Lining: Mitsubishi 1500-grade alumina fiber
• Electrical Requirements: 208–240 VAC, 50/60 Hz, single phase
• Vacuum Sealing Flange Kit: Includes vacuum gauge, two valves, and thermal ceramic blocks.

Gas Mixing System

• Supports customized gas mixing for CVD and PECVD applications.

Vacuum Pump and Cart

• Compatible with optional vacuum pump and digital vacuum controller for precise pressure control.

RF Generator

• Electrical Requirements: 208–240 VAC, 50/60 Hz
• Cooling: Air-cooled

Applications

1. Thin Film Deposition
   • CVD and PECVD for semiconductor devices, solar cells, and MEMS.
2. Material Research
   • Synthesis of advanced materials, including carbon nanotubes, graphene, and nitrides.
3. Plasma Processing
   • Plasma etching and surface modification for enhanced material properties.

This furnace system is a complete solution for advanced material synthesis, ensuring reliable, safe, and efficient operation for demanding research and industrial tasks.